| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board by which a wiring pattern of a pad or the like, can be exposed without damaging the wiring pattern or the like, nor causing the printed circuit board to warp or twist. SOLUTION: The method of manufacturing the printed circuit board has an insulating resin layer including glass cloth as solder resist for protecting a wiring pattern of an outer layer. The method includes at least the steps of: forming the wiring pattern on the outer layer of an insulating substrate; laminating the insulating resin layer having the glass cloth in a photo/thermosetting resin on the outer layer of the insulating substrate where the wiring pattern is formed; removing at least resin on the wiring pattern to be exposed from the insulating resin layer through exposure/development processing; full-scale curing the insulating resin layer by processing the substrate after the exposure/development processing at high temperature; and providing an opening in the insulating resin layer by removing glass cloth, exposed by the removal of the resin, through sand blast processing or wet blast processing. COPYRIGHT: (C)2011,JPO&INPIT |
