发明名称 |
Method and device for thermocompression bonding |
摘要 |
There are provided a method and device for thermocompression bonding of possibly preventing any warping of a resin member to be caused by thermocompression bonding, and of possibly reducing the time to be taken for processing. The method for thermocompression bonding, includes: preheating a resin member using an infrared radiation section; and subjecting the resin member to thermocompression bonding using a heating section and a pressurization section. |
申请公布号 |
EP2441518(A3) |
申请公布日期 |
2013.12.04 |
申请号 |
EP20110182722 |
申请日期 |
2011.09.26 |
申请人 |
SONY CORPORATION;SONY DADC CORPORATION |
发明人 |
MUROTA, TSUKASA |
分类号 |
B01L3/00;B29C35/08;B29C65/18;B29C65/78;B29C65/82;B81C3/00 |
主分类号 |
B01L3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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