发明名称 |
DISCRETE SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD |
摘要 |
<p>Disclosed is a discrete semiconductor device package (100) comprising a semiconductor die (110) having a first surface and a second surface opposite said first surface carrying a contact (112); a conductive body (120) on said contact; an encapsulation material (130) laterally encapsulating said conductive body; and a capping member (140, 610) such as a solder cap, a further semiconductor die or a combination thereof in conductive contact with the solder portion, said solder cap extending over the encapsulation material. A further solder cap (150) may be provided over the first surface. A method of manufacturing such a discrete semiconductor device package is also disclosed.</p> |
申请公布号 |
EP2669936(A1) |
申请公布日期 |
2013.12.04 |
申请号 |
EP20120170528 |
申请日期 |
2012.06.01 |
申请人 |
NXP B.V. |
发明人 |
BOETTCHER, TIM;WALCZYK, SVEN;GROENHUIS, ROELF;BRENNER, ROLF;DE BRUIN, EMIEL |
分类号 |
H01L21/56;H01L23/31;H01L23/485;H01L25/065 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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