发明名称 DUAL BAND SAW FILTER AND MANUFACTURING METHOD THEREOF
摘要 The present invention relates to an etching (eching) mode on the piezoelectric wafer. It is also about a dual band saw filter in which a completed high frequency band filter and a low frequency band filter are completed to the lift off (lift-off) mode and both coexist. The invention includes an original electrode with a thickness for the high frequency in the etching (Eching) mode, and the electrode for the low frequency patterned on one side on the piezoelectric wafer, and the electrode for the high frequency additionally patterned on the other side of the piezoelectric wafer as the thickness of the electrode for the low frequency is added, and it becomes the patterning (Patterning). The thickness patterned to the addition of the electrode for the electrode of the low frequency and of the high frequency are patterned to the lift off (Lift-off) mode.
申请公布号 KR20130132041(A) 申请公布日期 2013.12.04
申请号 KR20120056107 申请日期 2012.05.25
申请人 WISOL CO., LTD. 发明人 PARK, HYANG JA
分类号 H03H9/64;H03H3/08 主分类号 H03H9/64
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