| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible substrate that facilitates soldering operation even when it is compelled to select a routing method such that a connection portion is hidden behind a coupling portion because of restrictions of a device. SOLUTION: The flexible substrate includes a base 10 having a connection portion 11 formed on one side, a connection portion 12 formed on the other side, and a coupling portion 13 coupling those connection portions 11 and 12 and formed straight, wherein the connection portion 12 to be connected later to a predetermined place by soldering between the connection portions 11 and 12 on the one side and the other side has land formation regions 121 protruding outward from both edges of the coupling portion 13, and lands 222 where solder is fixed are formed in the land formation regions 121. COPYRIGHT: (C)2011,JPO&INPIT |
