发明名称
摘要 A semiconductor power amplifier of an embodiment includes: a plurality of unit FETs disposed in parallel in a direction of a substantially straight line connecting source electrodes of the unit FETs; a first via hole which connects the two source electrodes positioned between adjacent ones of the unit FETs in common and an RF ground electrode; and a second via hole which connects the source electrode on a side having no adjacent unit FET and the RF ground electrode. Each unit FET includes: a gate electrode which connects gate finger electrodes and leads out the gate finger electrodes; a drain electrode which connects drain finger electrodes disposed facing the gate finger electrodes and leads out the drain finger electrodes; and two source electrodes which connects source finger electrodes disposed facing the gate finger electrodes and lead out the source finger electrodes to opposing sides in a widthwise direction thereof.
申请公布号 JP5361951(B2) 申请公布日期 2013.12.04
申请号 JP20110135157 申请日期 2011.06.17
申请人 发明人
分类号 H01L21/8232;H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L23/522;H01L27/04;H01L27/06;H01L27/095;H03F3/19;H03F3/20;H03F3/60 主分类号 H01L21/8232
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