RESIN COMPOSITION FOR EXPANSION MOLDING

摘要

The present invention provides a resin composition for foam molding which can achieve high expansion ratio and can significantly improve tactile impression and vibration damping properties of the foam molding to be obtained. The present invention relates to a resin composition for foam molding comprising: a thermally expandable microcapsule that includes a shell containing an epoxy resin and a core agent that is a volatile expansion agent encapsulated by the shell; a thermoplastic resin; and a curable compound having two or more functional groups each selected from the group consisting of a carboxy group, a hydroxy group, an amino group, an amido group, and an acid anhydride group in each molecule.