| 摘要 |
<p>A single material tape is shaped into first, second and third frames isolated from and disposed opposite each other, and a press forming process is performed to thin bottoms of first and second wire-bonding sectors extending from the first and second frames. The thickness of each of the first and second wire-bonding sectors is smaller than that of the third frame, so that the thicker third frame can be exposed out of a glue body to achieve the better dissipation effect, and at least one side surface between the two frames isolated from and disposed opposite each other is formed with a slot portion. When the frame is applied to the light emitting diode and fixed to the glue body, the slot portion can increase the bonding property between the frame and the glue body, and the structural strength therebetween can be increased.
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