SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

The present invention provides a method for manufacturing a semiconductor package including accurate through wiring with a low process defect. According to one embodiment of the present invention, the semiconductor package includes an insulating substrate including a first through part and a second through part; through wiring charging the first through part and penetrating the insulating substrate; a semiconductor chip electrically connected to the through wiring and located in the second through part; a molding member having a recess region exposing the uppermost part of the through wiring and molding the insulating substrate and the semiconductor chip; a rewiring pattern layer electrically connecting the semiconductor chip and the through wiring and located on the lower part of the insulating substrate; and an external connection member electrically connected to the rewiring pattern layer.