PCB SUBSTRATE HAVING COPPER BUMP FOR EXTERNAL CONNECTION AND METHOD OF MANUFACTURING THE SAME

摘要

In a method for manufacturing a printed circuit board according to an embodiment of the present invention, provided is a carrier substrate including a base copper layer arranged on an insulating core layer. At least one or more circuit pattern layers are formed on the top surface of the base copper layer. A solder mask pattern is formed on the circuit pattern layers, and an external connection pad is formed on part of the circuit pattern layers exposed by the first solder mask pattern. After separating the insulating core layer and the base copper layer of the carrier substrate, the bottom surface of the base copper layer is exposed. A copper bump for external connection, which is electrically connected with the circuit pattern layers, is formed by patterning the exposed base copper layer. [Reference numerals] (210) Provide a carrier substrate including a base copper layer mounted on an insulating core layer;(220) Form at least one circuit pattern layer on the upper surface of the base copper layer;(230) Form a solder mask pattern and an external access pad on the at least one circuit pattern layer;(240) Separate the insulating core layer and the base copper layer on the carrier substrate from each other to expose the lower surface of the base copper layer;(250) Form an external access copper bump electrically connected to the at least one circuit pattern layer by patterning the exposed base copper layer