发明名称
摘要 A copper foil provided with a carrier which can suppress bending of a copper foil regardless of kinds and thicknesses of ultrathin copper layers and carriers is provided. The copper foil includes a carrier having a copper foil carrier, a middle layer laminated on the copper foil carrier and an ultrathin copper layer laminated on the middle layer. The absolute value [(T/2)×D] of the product of 1/2 of the total thickness (T) of the copper foil having the carrier and the difference (D) between the residual stress of the outside surface of the copper foil carrier and the residual stress of the outside surface of the ultrathin copper layer is within a range of 0 to 155μm·MPa.
申请公布号 JP5358740(B1) 申请公布日期 2013.12.04
申请号 JP20130016116 申请日期 2013.01.30
申请人 发明人
分类号 B32B15/20;H05K1/09 主分类号 B32B15/20
代理机构 代理人
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