| 摘要 |
PURPOSE: An insert carrier and a manufacturing method thereof are provided to prevent damage to the structure of a carrier by repetitively supporting a semiconductor package. CONSTITUTION: A supporting plate (330) is arranged at a lower surface (313) of a pocket unit (310) and includes a film (331) connecting to the lower surface and a metal frame (335). The metal frame corresponds to the external area of the film. A combining hole (333) is formed at the external area. Another combining hole (336) corresponding to the combining hole is formed on the metal frame. The combining hole of the metal frame includes a first inner diameter unit (337) and a second inner diameter unit (338). |
