发明名称 Expanded polypropylene copolymer resin particles
摘要 Disclosed is an expanded polypropylene copolymer resin particle whose base resin is a polypropylene random copolymer resin having a melting point of not more than 145� C., the base resin having a H/W ratio of not more than 8 where H (%) is a maximum height of an elution peak and W (� C.) is a peak width at half a height of the peak in an elution curve obtained from a differential value of eluted content measured by cross fractionation chromatography, and a ratio (Mw/Mn) of a weight-average molecular weight (Mw) and a number-average molecular weight (Mn) being not less than 3.5 in a molecular weight distribution measurement of a whole of eluted components. With such an expanded polypropylene copolymer resin particle, it is possible to provide expanded polypropylene copolymer resin particles which are capable of producing an in-mold expansion-molded article with a low molding heating vapor pressure, and which causes few deformation or shrinkage of an obtained in-mold expansion-molded article (i.e. having a broad molding heating temperature range) even if the in-mold expansion molding is carried out with a high molding heating vapor pressure and has a low decrease in physical properties such as compression strength.
申请公布号 US8598242(B2) 申请公布日期 2013.12.03
申请号 US201013262495 申请日期 2010.03.30
申请人 SENDA KENICHI;KANEKA CORPORATION 发明人 SENDA KENICHI
分类号 C08J9/16;B29C44/44;C08F210/00;C08J9/00;C08J9/18;C08J9/22 主分类号 C08J9/16
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