| 摘要 |
An integrated circuit (IC) package substrate with an embedded stiffener is disclosed. The IC package substrate is a multilayer package substrate that has build-up layers and metal layers stacked up alternately and a core layer in between the multiple build-up and metal layers. The core layer has an embedded stiffener that surrounds a perimeter of the core layer. Metal layers and build-up layers that are stacked alternately are placed on each surface of the core layer. Each metal layer has transmission traces and each build-up layer has vias that connect the transmission traces on one metal layer to the transmission traces on another metal layer. The embedded stiffener in the IC package substrate creates a more stable IC package structure and may eliminate the need to have a stiffener in addition to the IC package substrate. |
