发明名称 |
Electronic assemblies mating system |
摘要 |
A system to mate electronic assemblies includes a computer backplane, and a first electronic interconnect carried by the computer backplane configured to operationally mate with a first electronic assembly. The system also includes a second electronic interconnect carried by the computer backplane that is physically separate from the first electronic interconnect, the second electronic interconnect configured to operationally mate with a second electronic assembly where the first electronic assembly and the second electronic assembly mate with the computer backplane at substantially a same time. |
申请公布号 |
US8597032(B2) |
申请公布日期 |
2013.12.03 |
申请号 |
US201113035921 |
申请日期 |
2011.02.26 |
申请人 |
BRODSKY WILLIAM L.;MCKEEVER ERIC J.;TOROK JOHN G.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRODSKY WILLIAM L.;MCKEEVER ERIC J.;TOROK JOHN G. |
分类号 |
H01R12/00;H05K1/00 |
主分类号 |
H01R12/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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