发明名称 Floor through-passage molding apparatus
摘要 The present invention provides a floor through-passage molding apparatus adapted for a floor construction, which comprises a forming sleeve, a first covering plate assembly, a second covering plate assembly and a plurality of retaining assemblies. Said forming sleeve has a sleeve wall defining a hollow channel, a first opening and a second opening. Said first and second covering plate assemblies are respectively disposed on the first and second openings of said forming sleeve. Said plurality of retaining assemblies passes through the hollow channel of said forming sleeve, and are respectively retained with the first and second covering plate assemblies by a plurality of corresponding retaining holes formed on said first and second covering plate assemblies, wherein positions of the plurality of corresponding retaining holes distributed on said first covering plate assembly or said second covering plate assembly jointly define at least one plane.
申请公布号 US8596605(B2) 申请公布日期 2013.12.03
申请号 US20100997728 申请日期 2010.11.26
申请人 XIE YANBO;XIA TING;ZHANG WEI;SHENZSHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 XIE YANBO;XIA TING;ZHANG WEI
分类号 E04G15/06;B28B7/28 主分类号 E04G15/06
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