发明名称 Die pad package with a concave portion in the sealing resin
摘要 A rear surface opposite to one plane of a die pad is formed to be exposed from one plane of a sealing resin. In addition, a concave portion disposed to be parallel with at least a first side of an outermost edge of a central structure and a second side adjacent to the first side, respectively, is formed in the one plane of the sealing resin. Here, a depth of the concave portion is equal to or greater than a height of the outermost edge of the central structure.
申请公布号 US8598693(B2) 申请公布日期 2013.12.03
申请号 US201113206172 申请日期 2011.08.09
申请人 NISHIKAWA KENJI;RENESAS ELECTRONICS CORPORATION 发明人 NISHIKAWA KENJI
分类号 H01L23/495;H01L21/00 主分类号 H01L23/495
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