发明名称 ELECTROCONDUCTIVE THIN ADHESIVE SHEET
摘要 <p>The purpose of the present invention is to provide an electroconductive thin adhesive sheet with improved adhesive property, productivity, conductivity, and adhesive property. To solve the problem, the thin adhesive sheet has thickness of 40 micrometers or less and includes a conductive substrate and a conductive adhesive layer including conductive particles, wherein the particle diameter d50 of a conductive particle is 4-12 micrometers, d85 is 6-15 micrometers, and the thickness of the adhesive layer is 6-12 micrometers. Accordingly, the thin adhesive sheet improves productivity, adhesive property, and conductivity.</p>
申请公布号 KR20130131236(A) 申请公布日期 2013.12.03
申请号 KR20130057069 申请日期 2013.05.21
申请人 DIC CORPORATION 发明人 YAMAKAMI AKIRA;KURATA YOSHIHIRO;TAKANO HIROKI
分类号 C09J7/02;C09J9/02;C09J133/04 主分类号 C09J7/02
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