发明名称 |
Method for manufacturing a device on a substrate |
摘要 |
A method for manufacturing a device on a substrate includes forming a layer structure on the substrate, forming an auxiliary layer on the layer structure, forming a planarization layer on the auxiliary layer and on the substrate, exposing the auxiliary layer by a chemical mechanical polishing process and removing at least partly the auxiliary layer to form a planar surface of the remaining auxiliary layer or of the layer structure and the planarization layer. The chemical mechanical polishing process has a first removal rate with respect to the planarization layer and a second removal rate with respect to the auxiliary layer and the first removal rate is greater than the second removal rate. |
申请公布号 |
US8597531(B2) |
申请公布日期 |
2013.12.03 |
申请号 |
US20090417100 |
申请日期 |
2009.04.02 |
申请人 |
OBERNHUBER SANDRA;JALICS CHRISTOF;ADLER JOERG;HOECKELE UWE;PREIS WALTER;GOELLNER REINHARD;SCHEST TANJA;NICKUT PATRICIA;INFINEON TECHNOLOGIES AG |
发明人 |
OBERNHUBER SANDRA;JALICS CHRISTOF;ADLER JOERG;HOECKELE UWE;PREIS WALTER;GOELLNER REINHARD;SCHEST TANJA;NICKUT PATRICIA |
分类号 |
C03C15/00 |
主分类号 |
C03C15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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