发明名称 Multi-die LED package and backlight unit using the same
摘要 A multi-die LED package comprises a diode that works as a light-emitting diode for emitting light and as a sensing diode for detecting at least one physical quantity. The multi-die LED package is able to provide desired luminance and color independent of aging, temperature or other effects.
申请公布号 US8596816(B2) 申请公布日期 2013.12.03
申请号 US201013320055 申请日期 2010.05.25
申请人 ATKINS ROBIN;DOLBY LABORATORIES LICENSING CORPORATION 发明人 ATKINS ROBIN
分类号 F21V9/00 主分类号 F21V9/00
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