发明名称 CHEMICAL VAPOR DEPOSITION APPARATUS
摘要 System and method for forming one or more materials. The system includes a susceptor component configured to rotate around a central axis, and a showerhead component that is located above the susceptor component and not in direct contact with the susceptor component. Additionally, the system includes one or more substrate holders located on the susceptor component and configured to rotate around the central axis and also rotate around corresponding holder axes respectively, and a central component. Moreover, the system includes one or more first inlets formed within the central component, one or more second inlets, and one or more third inlets formed within the showerhead component and located farther away from the central component than the one or more second inlets.
申请公布号 KR101336489(B1) 申请公布日期 2013.12.03
申请号 KR20110106226 申请日期 2011.10.18
申请人 发明人
分类号 C23C16/18;C23C16/44;H01L21/205 主分类号 C23C16/18
代理机构 代理人
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