| 摘要 |
Disclosed is a method that, in the cutting of a polarizing plate using laser light, cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, without causing deformation of the cut surface. The method cuts a polarizing plate, which contains a layer that is a film having an average rate of absorption of laser light in the emission wavelength range of the radiated laser light of no more than 2%, and said method contains: a groove-forming step that forms a groove in the abovementioned film by means of radiating laser light having a regulated output and/or rate of traversing; and a tearing step that tears the abovementioned polarizing plate along the abovementioned groove after the abovementioned groove-forming step while regulating the tearing angle and the tension applied to the polarizing plate. |
