An apparatus and a method for grinding a substrate are disclosed. The apparatus for grinding a substrate comprises a stage unit, a grinding unit, a camera unit, and a replacement unit. The grinding unit has a grinding wheel and grinds the edge of a substrate. The camera unit photographs the grinding wheel and analyzes the photographed images in order to generate information on the grinding wheel. The replacement unit has a preparatory grinding wheel, and supplies or collects the preparatory grinding wheel to or from the grinding unit. The apparatus for grinding a substrate compensates for the position of the grinding wheel or replaces the grinding wheel based on the information on the grinding wheel.
申请公布号
KR20130130542(A)
申请公布日期
2013.12.02
申请号
KR20120054443
申请日期
2012.05.22
申请人
SAMSUNG DISPLAY CO., LTD.
发明人
LEE, IN HO;JEONG, HWAN KYEONG;KIM, JIN WOO;PARK, GOANG YOUNG;BACK, SANG HOON;AN, EE HYUN