METHOD OF EJECTING A DIE FROM A WAFER, DIE EJECTING UNIT AND APPARATUS OF PICKING UP A DIE

摘要

Provided is a method for ejecting a die in which the outside portion surrounding a die of a dicing tape to which a wafer divided into at least one die is attached is sucked downwards, a first region corresponding to one side of the die is pressed to be raised compared to other regions, and the die is separated from the dicing tape by continuously pressing the dicing tape towards a second region facing the first region. [Reference numerals] (AA) START;(BB) End;(S110) Suck a die upwards;(S120) Suck the outer part of a dicing tape downwards;(S131) Place a contact unit under a first region;(S133) Get the contact unit in touch with the first region;(S140) Continuously press the dicing tape towards a second region