| 摘要 |
PURPOSE: An electromagnetic wave shielding film and a manufacturing method thereof are provided to shield electromagnetic wave noise by being attached to a flexible printed wiring board etc., as having inflexibility and heat resistance to endure high temperature in lead-free soldering reflow process. CONSTITUTION: An electromagnetic wave shielding film includes an insulation layer (2), a primer layer (3) and a conductive adhesive layer (4). The primer layer is formed on the insulation layer. The conductive adhesive layer is formed by coating and drying a conductive adhesive composition. The insulation layer is a polyimide film which is formed by manufacturing polyamic acid by mixing the mixture of 4,4'-oxydianiline (ODA) and p-phenylene diamine (p-PDA) and the mixture of pyromellitic dianhydride (PMDA) and 4,4'- biphenyltetracarboxylic dianhydride (BPDA) with the ratio of 1:1 to be polyimide and comprises molecular weight 5,000-1,000,000 which are irregularly arranged. |
