发明名称 LED PACKAGE MODUAL
摘要 PURPOSE: An LED package module is provided to easily replace bad unit LED packages by forming an array structure of unit LED packages. CONSTITUTION: At least one PKG substrate (130) has a puzzle pattern. A unit LED package (120) is formed on the PKG substrate. A main board (110) has a puzzle-type dummy unit pattern. The PKG substrate is inserted into the main board. An electrode pad is formed on the PKG substrate.
申请公布号 KR101333478(B1) 申请公布日期 2013.12.02
申请号 KR20110145552 申请日期 2011.12.29
申请人 发明人
分类号 H01L33/48 主分类号 H01L33/48
代理机构 代理人
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