发明名称 METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 <p>OF THE DISCLOSUREAn electronic component mounting device,includes a stage in which a plurality of stage portions are defined, a first heater provided in theplurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head.[FIG. 15]</p>
申请公布号 SG194315(A1) 申请公布日期 2013.11.29
申请号 SG20130029657 申请日期 2013.04.18
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD 发明人 YOSHITADA HIGASHIZAWA;KOSUKE KOBAYASHI;YUKINORI HATAYAMA
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