| 摘要 |
Provided are a resin composition, pre-preg therefor, and metal foil clad layer plate, that can be suitably used as a printed wiring board for LED packaging with high light reflectivity in the ultraviolet light region and the visible light region, that does not lose light reflectivity due to heating and light irradiation, and that also has excellent peel strength relative to a metal foil. This resin composition includes at least (A) an epoxy resin having a bisphenol A backbone, (B) an alicyclic epoxy resin, (C) an acid anhydride of a partially hydrogenated compound or a totally hydrogenated compound of an aromatic polycarboxylic acid, (D) titanium dioxide, and (E) a dispersing agent. |
