| 摘要 |
IN ORDER TO PROVIDE AN ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS THAT IS EXCELLENT IN ADHESION DURABILITY UNDER LONG-TERM HIGH TEMPERATURE CONDITIONS, THERMAL CYCLABILITY, AND INSULATION RELIABILITY, DESIGNED IS AN ADHESIVE COMPOSITION FOR ELECTRONIC COMPONENTS CONTAINING A THERMOPLASTIC RESIN (A), AN EPOXY RESIN (B), A HARDENER (C), AND AN ORGANOPOLYSILOXANE (D), WHEREIN THE GLASS TRANSITION TEMPERATURE (TG) AFTER CURING IS -10°C TO 50°C AND THE RATE OF CHANGE OF TG AFTER HEAT-TREATING THE COMPOSITION AT 175°C FOR 1000 HOURS IS 15% OR LESS. |
