SIDE GAP DISPENSING DEVICE AND METHOD OF BONDING SUBSTRATES, AND APPARATUS AND METHOD OF BONDING SUBSTRATES HAVING THE SAME

摘要

Disclosed are an apparatus and a method for dispensing a side gap for bonding a substrate and an apparatus and a method for bonding the substrate including the same. The apparatus for dispensing the side gap for bonding the substrate according to the present invention includes: a needle member which discharges a third bonding solution to a gap area in which a top substrate is bonded to a bottom substrate; a holder which supports the needle member; and a holder arm which mounts the holder and controls the movement of the needle member.