| 摘要 |
The substrate on which deposition takes place has conductive structures to which potential is applied and which, during the deposition, have an attractive effect on the liquid atomized by electrospray. As a result, the charged material is directed from the atomized liquid to the conductive structures and deposited on the latter or above said structures. Only said structures are coated or coating is effected above said structures, while non-conductive regions situated alongside or repulsively polarized regions situated alongside are not coated. Therefore, it is not necessary to cover said non-conductive or repulsively polarized regions by a mask. Despite structured coating over relatively large areas, therefore, no time-consuming mask technique or lithography steps are necessary. |
