发明名称 PRINTED CIRCUIT BOARD ASSEMBLY
摘要 The present invention relates to a printed circuit board assembly (10), said printed circuit board assembly comprising: a substrate (100); two or more electronic components which are categorized, wherein each component is secured to the substrate by securing means having a different predetermined thermal-release temperature, depending on which category said component belongs to. The invention furthermore relates to a method of assembling the printed circuit board assembly and a method of disassembling the printed circuit board assembly according to the invention.
申请公布号 US2013314885(A1) 申请公布日期 2013.11.28
申请号 US201213982036 申请日期 2012.01.30
申请人 JI HANGFENG;BALKENENDE ABRAHAM RUDOLF;CHEN HONG;KONINKLIJKE PHILIPS N.V. 发明人 JI HANGFENG;BALKENENDE ABRAHAM RUDOLF;CHEN HONG
分类号 H05K3/30 主分类号 H05K3/30
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