发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
A printed circuit board and a manufacturing method of the same are disclosed. The method includes: preparing a carrier including a primer resin layer formed thereon; forming a circuit pattern on the primer resin layer; stacking the carrier onto an insulating layer such that the circuit pattern is buried in the insulating layer; removing the carrier; forming a via hole in the insulating layer on which the primer resin layer is stacked; and forming a conductive via in the via hole. The conductive via is formed by forming a plating layer in the via hole and on the primer resin layer and removing a portion of the plating layer formed over the primer resin layer.
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申请公布号 |
US2013312901(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
US201313953650 |
申请日期 |
2013.07.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE JAE-SEOK |
分类号 |
H05K3/10;H05K3/22 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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