RESIN COMPOSITION, PREPREG, CIRCUIT BOARD, AND SEMICONDUCTOR APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide: a resin composition and a prepreg, from which a circuit board preventing migration and high in electric reliability can be manufactured; a circuit board high in electric reliability; and a semiconductor apparatus having the circuit board and high in reliability.SOLUTION: A resin composition is used for forming a prepreg sheet by impregnating the resin composition in a base material, wherein: the resin composition contains a thermosetting resin and a curing agent; and the concentration of calcium ions is ≤70 ppm. The thermosetting resin is preferably an epoxy resin. The curing agent is preferably a phenol resin, and the phenol resin is preferably a novolac phenol resin.