发明名称 WIRING SUBSTRATE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring substrate manufacturing method which can form wiring including &pgr;-conjugated system conductive polymer on a surface of an insulating base material simply and with high definition, and which can achieve high conductivity and transparency.SOLUTION: A wiring substrate manufacturing method of a present embodiment comprises: a conductive polymer coated film formation process of forming a conductive polymer coated film by coating at least on one surface of an insulating base material, a conductive polymer dispersion liquid which includes &pgr;-conjugated system conductive polymer, polyanion and a dispersion media; a resist film formation process of forming a resist film on a surface of the conductive polymer coated film by printing a resist paste which includes a resist film forming resin and a resist film forming medium by screen printing and in a predetermined pattern; an inactivation process of processing the conductive polymer coated film which is not coated by the resist film by an etchant which inactivates the conductive polymer coated film; and a resist film removal process of dissolving or swelling the resist film by a solvent for removal after the inactivation process to remove the resist film.
申请公布号 JP2013239680(A) 申请公布日期 2013.11.28
申请号 JP20120113503 申请日期 2012.05.17
申请人 SHIN ETSU POLYMER CO LTD 发明人 YOSHIDA KAZUYOSHI;FUJITSUNA KENICHI
分类号 H05K3/02;H01B13/00;H05K3/10 主分类号 H05K3/02
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