| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer level package capable of reducing a process cost without the need for increasing the height of a metal post and allowing the metal post to play a role of a buffer to deformation of the package due to a CTE mismatch between the wafer level package and a wiring substrate by forming the metal post with a concave side surface.SOLUTION: There is provided a wafer level package including: a wafer 10 having a die pad 11; a redistribution line 13 formed to be connected on a top surface of the die pad 11; metal posts 15 each connected to a top surface of the redistribution line 13 and having a concave side surface; and a molding resin 14 formed between the metal posts 15. |
