| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which reduces a displacement of a bonding position between an inner lead and a protruding electrode, and easily achieves fine pitching of the inner lead and the protruding electrode.SOLUTION: A semiconductor device comprises: a plurality of first protruding electrodes 15 arranged on a peripheral edge part 22 of a semiconductor chip 20; and a plurality of first lead wires 12 formed on a film substrate, each of first protruding electrodes 15 and each of the first lead wires 12 are connected each other, and thereby the semiconductor device is connected to an inner circuit of the chip. A second protruding electrode 18 is arranged on a positional deviation prevention region 23 on the peripheral edge part of the semiconductor chip, a second lead wire 14 is arranged on a region of the film substrate corresponding to the positional deviation prevention region 23, and a positional deviation prevention pattern is arranged so that at least one second lead wire 14 sandwiched between the second protruding electrodes 18. |
