发明名称 |
THIN FILM CONDENSER FOR HIGH-DENSITY PACKAGING, METHOD FOR MANUFACTURING THE SAME, AND HIGH-DENSITY PACKAGE SUBSTRATE INCLUDING THE SAME |
摘要 |
Provided are a thin film condenser for high-density packaging, a method for manufacturing the same and a high-density package substrate. The thin film condenser for high-density packaging, includes: a support substrate; a lower electrode formed on the support substrate; a dielectric thin film formed on the lower electrode; and an upper electrode formed on the dielectric thin film. Provided also is a method for manufacturing the same. The high-density package substrate, includes: at least two stacked substrates; thin film condensers embedded in the stacked substrates; an internal connection electrode formed in the stacked substrates and connecting the thin film condensers in series or in parallel; a surface electrode formed on the surface of the outermost substrate among the stacked substrates and connected to the internal connection electrode; and an integrated circuit connected to the surface electrode via a bump.
|
申请公布号 |
US2013314842(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
US201213677664 |
申请日期 |
2012.11.15 |
申请人 |
KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
KANG CHONG YUN;KANG MIN GYU;YOON SEOK JIN;CHOI JI WON;BAEK SEUNG HYUB;KIM JIN SANG |
分类号 |
H01G4/06;H05K5/00 |
主分类号 |
H01G4/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|