| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique for achieving such a state that an annular adhesive layer is arranged at an optimum position when an adhesive tape, having an annular adhesive layer arranged for a wafer, is stuck.SOLUTION: The sticking method of an adhesive tape includes a step for positioning the central part of a wafer directly under the central part of an adhesive tape, a step for pressing the adhesive tape against the surface of a wafer by means of a sticking roller positioned to cover the diameter of the adhesive tape by passing the central part of an adhesive tape, and sticking a part of the adhesive tape fixedly to the wafer at a position where the central part of an adhesive tape overlaps the central part of the wafer, and a step for sticking the adhesive tape to the wafer by rotary moving the sticking roller from the central part of the wafer toward the peripheral part thereof following the partial sticking step. |
