SYSTEM AND METHOD FOR WAFER SURFACE FEATURE DETECTION, CLASSIFICATION AND QUANTIFICATION WITH WAFER GEOMETRY METROLOGY TOOL

摘要

PROBLEM TO BE SOLVED: To provide systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems.SOLUTION: The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features. The detected defects are classified and important defect metrology information of height/depth, area and volume is reported. Therefore, the systems and methods in accordance with the present disclosure provide more values for quantifying the negative effect of these defects on the wafer quality.