| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus housing structure which meets demands for the downsizing and the weight reduction of an electronic apparatus housing.SOLUTION: A wall surface panel 4 of an electronic apparatus housing 1 is formed by a cooling unit 5 where a heat radiation heat sink 9 and an endothermic heat sink 10 are respectively disposed on the one surface side and the other surface side of a Peltier module 6. The endothermic heat sink 10 is disposed in the electronic apparatus housing 1 and the heat radiation heat sink 9 is disposed at the exterior of the electronic apparatus housing 1. |
