ELECTRONIC COMPONENT MOUNTING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide an electronic component mounting substrate which realizes proper heat radiation characteristics and inhibits the enlargement without increasing the costs.SOLUTION: A signal system electronic component performing signal processing and a power system electronic component 3 controlling a power system are mounted on a substrate 1. The substrate 1 includes a signal system connection terminal 2 where one end part 2a is connected with the substrate 1 and a first shell part 2c is disposed on an upper surface of the power system electronic component 3.