PACKAGING SUBSTRATE WITH RELIABLE VIA STRUCTURE

摘要

A packaging substrate includes a high reliability via structure that extends through multiple layers of the packaging substrate. The via structure includes an opening formed through multiple layers of the packaging substrate and an electrically conductive layer that is deposited in the opening. The opening is formed in a single material removal process and the conductive layer is formed in a single deposition process. Because the conductive layer is formed in a single deposition process, the conductive layer provides an interface-free conductive path between the multiple layers.