| 摘要 |
The present invention relates to a cover ray film adhesion device and a multi-layer flexible circuit board manufacturing method using the same, and a cover ray film adhesion device of the present invention comprises a first mold, a second mold, a guide member, a first heating member, and a second heating member. Also, a multi-layer flexible circuit board manufacturing method using the same of the present invention comprises: a flexible circuit board assembly preparing step, a cover ray film slightly adhering step, a cover ray film tightly adhering step, a base substrate stacking step, a simultaneous hot press step, a copper plating step, a circuit pattern forming step, a repetition step, a different cover ray film slightly adhering step, a different cover ray film tightly adhering step, a back-up plate adhering step, and a different simultaneous hot press step. |
