发明名称 VIBRATION DEVICE, MANUFACTURING METHOD OF VIBRATION DEVICE, ELECTRONIC APPARATUS, AND MOBILE OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a vibration device which allows the residual stress of a vibration piece to be reduced and prevents the residual stress from being relaxed with time, with enhanced fixing strength to a package.SOLUTION: A physical quantity sensor 1 includes a base substrate 10 having a plurality of through holes 11a, 11b, 11c, and 11d passing through from one principal plane 10a side to another principal plane 10b side, and a package 20 to which the base substrate 10 is attached. The through holes 11a, 11b, 11c, and 11d of the base substrate 10 have an aperture area on the one principal plane 10a which is smaller than the aperture area on the other principal plane 10b. The base substrate 10 is placed on a package 20, with the one principal plane 10a side as a fixing plane side, and fixed to the package 20 through metallic fixing members 50 which are arranged at the through holes 11a, 11b, 11c, and 11d and extend toward a package base 21 side.
申请公布号 JP2013238508(A) 申请公布日期 2013.11.28
申请号 JP20120112209 申请日期 2012.05.16
申请人 SEIKO EPSON CORP 发明人 WATANABE JUN;TAKASUGI TOSHIYASU
分类号 G01P15/10;G01C19/5621;G01C19/5628;H01L23/02;H01L23/04;H01L41/08;H01L41/18;H01L41/187;H01L41/22 主分类号 G01P15/10
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