| 摘要 |
PROBLEM TO BE SOLVED: To obtain a thin film forming apparatus, a thin film forming method and a thin film measuring method, capable of measuring a thin film at low cost and controlling a film thickness with high accuracy.SOLUTION: A thin film forming apparatus includes: a film forming chamber 6 in which a tray 1 on which a substrate 2 to be worked, which is an objective to be formed with a thin film, is placed, is subjected to a film formation process so that a placing region where the substrate 2 to be worked is placed, and a region other than the placing region are subjected to the film formation process; and a film thickness measuring unit 4 disposed in any positions in a conveyance route along which the tray 1 that is carried-out from the film forming chamber 6 after the film formation process, is conveyed, and measuring a thickness of the thin film that is formed by the film formation process. The film thickness measuring unit 4 measures a thickness of a thin film that is formed on a measuring objective part 3 disposed in a region other than the placing region in the tray 1, as a measuring object. |
