发明名称 RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURING FILM FOR ORGANIC EL ELEMENT, CURING FILM FOR ORGANIC EL ELEMENT, AND ORGANIC EL ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition that prevents element degradation caused by moisture absorption in production of an organic EL element and can form a desired pattern with excellent developability.SOLUTION: A radiation-sensitive resin composition includes [A1] a polymer comprising a polyamic acid having at least one of a group of the following formula (1) and a group of the formula (2), or a polyimide obtained by dehydration ring closure thereof, and [B] at least one of a compound of the following formula (3) and a compound of the formula (4).
申请公布号 JP2013238679(A) 申请公布日期 2013.11.28
申请号 JP20120110117 申请日期 2012.05.11
申请人 JSR CORP;TOKYO INSTITUTE OF TECHNOLOGY 发明人 YASUDA HIROYUKI;KONNO KEIJI;KURIYAMA KEISUKE;INOUE YUSUKE;SAITO YUTA;HIGASHIHARA TOMOYA;UEDA MITSURU
分类号 G03F7/023;C08G73/10;H01L51/50;H05B33/10;H05B33/22 主分类号 G03F7/023
代理机构 代理人
主权项
地址