发明名称 |
RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING CURING FILM FOR ORGANIC EL ELEMENT, CURING FILM FOR ORGANIC EL ELEMENT, AND ORGANIC EL ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition that prevents element degradation caused by moisture absorption in production of an organic EL element and can form a desired pattern with excellent developability.SOLUTION: A radiation-sensitive resin composition includes [A1] a polymer comprising a polyamic acid having at least one of a group of the following formula (1) and a group of the formula (2), or a polyimide obtained by dehydration ring closure thereof, and [B] at least one of a compound of the following formula (3) and a compound of the formula (4). |
申请公布号 |
JP2013238679(A) |
申请公布日期 |
2013.11.28 |
申请号 |
JP20120110117 |
申请日期 |
2012.05.11 |
申请人 |
JSR CORP;TOKYO INSTITUTE OF TECHNOLOGY |
发明人 |
YASUDA HIROYUKI;KONNO KEIJI;KURIYAMA KEISUKE;INOUE YUSUKE;SAITO YUTA;HIGASHIHARA TOMOYA;UEDA MITSURU |
分类号 |
G03F7/023;C08G73/10;H01L51/50;H05B33/10;H05B33/22 |
主分类号 |
G03F7/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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