发明名称 ELECTRIC TERMINALS SEALED WITH MICROENCAPSULATED POLYMERS
摘要 A method for sealing a terminal to a hole through a plastic body includes applying a microencapsulated polymer to a portion of the terminal that is to be sealed to the hole, the microencapsulated polymer including a plurality of microcapsules where each microcapsule includes a capsule wall with reactants within the capsule wall. The method also includes surrounding the portion of the terminal with the hole after applying the microencapsulated polymer. The capsule walls are ruptured to release the reactants and seal the terminal to the hole.
申请公布号 US2013313753(A1) 申请公布日期 2013.11.28
申请号 US201213480898 申请日期 2012.05.25
申请人 SCHEEL MARK A.;DELPHI TECHNOLOGIES, INC. 发明人 SCHEEL MARK A.
分类号 B29C39/10 主分类号 B29C39/10
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