发明名称 |
Multi-Chip Package and Method of Manufacturing Thereof |
摘要 |
A multi-chip package comprises a first chip accommodated in a first housing and a second chip accommodated in a second housing. The first housing and the second housing are arranged in a laterally spaced-apart relationship defining a gap between the first housing and the second housing. An interconnecting structure is configured to span the gap and to electrically couple the first chip and the second chip.
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申请公布号 |
US2013313712(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
US201213481630 |
申请日期 |
2012.05.25 |
申请人 |
OTREMBA RALF;HOEGLAUER JOSEF;SCHREDL JUERGEN;INFINEON TECHNOLOGIES AG |
发明人 |
OTREMBA RALF;HOEGLAUER JOSEF;SCHREDL JUERGEN |
分类号 |
H01L25/065;H01L21/60 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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