发明名称 |
MULTI-STACKED BBUL PACKAGE |
摘要 |
A method including forming a first portion of a build-up carrier on at least one first die, the at least one first die; coupling at least one second die to the first portion of the build-up carrier, the at least one second die separated from the first die by the at least one layer of conductive material disposed between layers of dielectric material; and after coupling the at least one second die to the first portion of the build-up carrier, forming a second portion of the build-up carrier on the at least one second die. An apparatus including a build-up carrier including including alternating layers of conductive material and dielectric material and at least two dice therein in different planes of the build-up carrier. |
申请公布号 |
WO2013176662(A1) |
申请公布日期 |
2013.11.28 |
申请号 |
WO2012US39062 |
申请日期 |
2012.05.23 |
申请人 |
INTEL CORPORATION;GOH, ENG HUAT;TEOH, HOAY TIEN |
发明人 |
GOH, ENG HUAT;TEOH, HOAY TIEN |
分类号 |
H01L23/48;H01L23/12 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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